№ 3 (188) 2024 р. С. 72–78

НОВІ КУПРУМ-ВМІСНІ ПОВ’ЯЗКИ ДЛЯ ЗАГОЄННЯ РАН: БІБЛІОМЕТРИЧНИЙ АНАЛІЗ

А. С. Буцик, Р. А. Москаленко

Українсько-шведський дослідницький центр SUMEYA, Медичний інститут, Сумський державний університет, Суми, Україна

DOI 10.32782/2226-2008-2024-3-12

Стаття присвячена аналізу літературних даних щодо використання наночастинок міді як антимікробного засобу для загоєння ран у зв’язку зі збільшенням кількості антибіотикорезистентних бактеріальних патогенів.

На основі досліджень 142 джерел було встановлено, що за останні 14 років кількість публікацій на вказану тему суттєво збільшилася, що пов’язано зі зростаючим інтересом науковців до нанотехнологій та пошуком альтернативних антимікробних речовин. Бібліометричний аналіз показав, що наночастинки міді активно вивчаються вченими в різних країнах світу, зокрема в Китаї, Індії та США. Їхня здатність пригнічувати ріст бактерій та сприяти ангіогенезу може бути використана безпосередньо під час лікування ран або додавання до перев’язувальних матеріалів для стимулювання регенерації тканин.

Ключові слова: наночастинки міді, загоєння ран, регенерація тканин, ранова пов’язка.

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